100% material declaration data sheet fgg680 PK112 (v1.2) september 22, 2006 ma terial declaration data sheet average weight: 9.648 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.3524 3.65% silicon 7440-21-3 100.00 0.1421 die attach material 0.027 0.28% silver 7440-22-4 75.00 0.020 resin trade secret 25.00 0.007 mold compound 0.4135 4.29% epoxy resins trade secret 26.00 0.106 sio2 60676-86-0 74.00 filler 0.306 laminate 0.7366 7.63% laminate trade secret 60.95 0.449 solder mask trade secret 21.44 0.158 copper 7440-50-8 15.47 metal layer 0.114 nickel 7440-02-0 1.62 metal layer 0.012 gold 7440-57-5 0.53 metal layer 0.004 heat sink 6.4063 66.40% copper 7440-50-8 97.50 6.246 iron 7439-89-6 2.35 0.151 phosphorus 7723-14-0 0.003 0.0002 zinc 7440-66-6 0.12 0.008 heat snk plating 0.2920 3.03% nickel 7440-05-0 100.00 0.2920 dam henkel fp4451 0.0130 0.13% epoxy resin trade secret 100.00 0.0.130 bond wire 0.0214 0.22% gold 7440-57-5 100.00 0.0214 solder balls 1.386 14.36% tin 7440-31-5 95.50 1.32363 silver 7440-22-4 4.00 0.05544 copper 7440-50-8 0.50 0.00693 PK112 (v1.2) september 22, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? fgg680 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 3/27/06 1.0 initial release. 5/15/06 1.1 100% material declaration. 9/22/06 1.2 update component descriptions. PK112 (v1.2) september 22, 2006
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